Silver-Bond 18 Rigid Highly Conductive Silver Epoxy Dual Cartridge Easy Mixing S

Description

PURE SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY, MAXIMUM CONTINUITY OF CONDUCTIVITY
PRODUCT DESCRIPTION:
Silver-Bond 18 Rigid Highly Conductive Silver Epoxy Dual Cartridge Easy Mixing System is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohmcm.
Silver-Bond 18 Rigid Highly Conductive Silver Epoxy Dual Cartridge Easy Mixing System is also characterized by a wide operating temperature range from 50 to +170C.
Silver-Bond 18 Rigid Highly Conductive Silver Epoxy Dual Cartridge Easy Mixing System is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
PRODUCT PROPERTIES:
Appearance
Silver
Cure Type
Heat cure or Room temperature
Benefits
High strength
Perfect bond
Cold solder for heat-sensitive components
Mix Ratio by weight
100:100 / Resin:Hardener
Substrates
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Operating Temperature
-50 to +170C
Typical Applications
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
UNCURED PROPERTIES:
Specific Gravity, mixed
2.79
Reactive solids contents, %
100
Pot Life
1 Hour
Shelf Life
1 Year
Viscosity
Paste
CURE SCHEDULE:
15 minutes
@ 100C
45 minutes
@ 50C
24 hours
Room temperature
CURED PROPERTIES:
Hardness, Shore D
85
Shrinkage linear in/in
0.0003
Lap shear strength, psi
5 N/mm
2
700 psi
Volume Resistivity ohm. cm
< 0.0001
Thermal Expansion Coefficient, (cm / cm / C 10-5)
1.5
Thermal Conductivity, btu / hr / ft2 / F / in
100
Tensile Strength, psi
9500
Compressive Strength, psi
14,000
Heat Distortion, C
95
Electrical Resistivity
< 1x10 -4 ohmcm/td>
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Silver-Bond 18 Rigid Highly Conductive Silver Epoxy Dual Cartridge Easy Mixing System completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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